The new "Thermal Package Description" allows you to define the thermal behavior of semiconductor modules that consist of multiple semiconductor chips.The thermal description for a MOSFET with Diode allows you to define gate dependent conduction losses to account for the fact that the MOSFET channel can conduct current in both directions.You can now define default values for custom variables that are used if the end user of a thermal description does not provide a value.Custom constants in thermal descriptions allow you to define internal constants to make formulae in loss definitions more readable.The built-in semiconductor components and converter models have a new optional parameter "Thermal interface resistance" for between the device and an external heat sink.PLECS contains updated documentation with example models for basic component usage, vectorization and common error messages. When you run a scripted simulation in PLECS Standalone, you can now specify an initial state used for the simulation.When you run a scripted simulation or steady-state analysis in PLECS Standalone, you can now control the simulation times included in the simulation result.Component labels can now be moved along the component icon similar to the labels of subsystem blocks.The implementation of the Space Vector PWM block has been changed to use a 3-Phase Index-Based Modulation block in series with a Symmetrical PWM block in order to facilitate the implementation of Space Vector PWM schemes on real-time hardware.The Symmetrical PWM block has been enhanced with additional sampling schemes.The new Variable Frequency PWM and Variable Phase PWM blocks generate PWM signals with variable frequency resp.The new Switch Loss Calculator block enables you to conveniently calculate the average switch loss of one or more components using a single block.PLECS can now export atomic subsystems as Model-Exchange Functional Mockup Units.You can now disable components by commenting them in order to exclude them from a simulation.
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